| 发明名称 |
BONDING SHEET AND MULTILAYER FLEXIBLE PRINTED WIRING BOARD USING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonding sheet which can enhance the rigidity of a multilayer flexible printed wiring board and from which the multilayer flexible printed wiring board can simply produced, and to provide a multilayer flexible printed wiring board using the same. <P>SOLUTION: This bonding sheet comprising a prepreg prepared by impregnating a woven fabric substrate or non-woven fabric substrate with an epoxy resin composition and used for a multilayer flexible printed wiring board is characterized in that the melt viscosity of the prepreg at 130°C is in a range of 3,000 to 70,000 poises. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
| 申请公布号 |
JP2006299209(A) |
申请公布日期 |
2006.11.02 |
| 申请号 |
JP20050127101 |
申请日期 |
2005.04.25 |
| 申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
ITO KATSUHIKO;YONEMOTO KAMIO;SAWADA TOMOAKI |
| 分类号 |
C09J7/04;C09J163/00;H05K1/03;H05K3/46 |
主分类号 |
C09J7/04 |
| 代理机构 |
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