| 摘要 |
PROBLEM TO BE SOLVED: To prevent a breakage and a chip of a substrate, by using the same apparatus continuously for processes from a grinding work to an elimination of a working distortions to the back face of the substrate, while keeping the state of suction of a semiconductor substrate to a suction chuck, without adhering a protection tape or the like to the surface of the substrate, when the semiconductor substrate is thinned. SOLUTION: A rough grinding work by a diamond grindstone 1 for the rough grinding, a finish grinding work by a diamond grindstone 2 for the finish grinding, and a working distortion elimination by a grindstone 3 containing abrasive grains comprising cerium oxide, are conducted in turn and continuously, by making a silicon substrate 31 such the suction chuck 4 at a waiting position and by moving the suction chuck 4 and the silicon substrate 31 keeping the state. COPYRIGHT: (C)2007,JPO&INPIT
|
