发明名称 |
Electronic component and electronic configuration |
摘要 |
An electronic component includes a substrate with outer contact areas comprising copper. Lead-free solder bumps are disposed on the outer contact areas of the electronic component. An electronic configuration includes an electronic component and a printed circuit board. The electronic component is mounted on the printed circuit board by lead-free solder electrical connections.
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申请公布号 |
US2006244142(A1) |
申请公布日期 |
2006.11.02 |
申请号 |
US20050115401 |
申请日期 |
2005.04.27 |
申请人 |
WAIDHAS BERND;BOCK GERALD;SCHOTT ALBERT |
发明人 |
WAIDHAS BERND;BOCK GERALD;SCHOTT ALBERT |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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