发明名称 |
System and method for aligning a wafer processing system in a laser marking system |
摘要 |
A system is disclosed for determining laser processing performance in a back side wafer marking system. The system includes a laser marking system for creating pattern marks on a back side of a target wafer, and a detection system for detecting the pattern marks through a front side of the target wafer. The target wafer includes a thickness, an index of refraction and two substantially planar surfaces such that the apparent focal area of the detection system through the target wafer is substantially close to the front side of the target wafer.
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申请公布号 |
US2006243711(A1) |
申请公布日期 |
2006.11.02 |
申请号 |
US20050118456 |
申请日期 |
2005.04.29 |
申请人 |
PARADIS ROBERT;BALLANTYNE KEITH;PAOLUCCI GARY;STREICH OLIVER |
发明人 |
PARADIS ROBERT;BALLANTYNE KEITH;PAOLUCCI GARY;STREICH OLIVER |
分类号 |
B23K26/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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