PAD OF CHEMICAL MECHANICAL POLISHING DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A pad of a CMP apparatus is provided to extend an interval of polishing time and improve polishing uniformity while simplifying a fabricating process by fixing a plurality of capsules with pores to a support layer while using a binder so that a plurality of layers for constituting a pad is formed. A polishing member(22) is formed on a support layer(21), made of at least one layer. The layer includes a plurality of capsules(22a) and a binder(22b). The plurality of capsules whose inside is empty are separated from each other by a uniform interval. The plurality of capsules are fixed to the upper part of the support layer by using a binder. The capsules are made of polymer having pores in its inside or made of water-soluble PVA(polyvinyl alcohol[acetate]) or starch.