| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To allow a resin package with a built-in semiconductor chip to be incorporated in a module having various package shapes, and to realize improvement in the flexibility of arrangement for the module, reduction in the classification of components, promotion of versatility of the components, miniaturization and mass production. <P>SOLUTION: A semiconductor chip-embedded resin package comprises a semiconductor chip 16 of a Hall element or the like; a resin package body 5 with the semiconductor chip 16 embedded therein; and a foldable lead frame 6 exposed from the resin package body 5 to be fitted, and electrically connected with the semiconductor chip 16 in the resin package body 5. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
