发明名称 |
FILM-PATTERN SUBSTRATE, FILM-PATTERN FORMING METHOD, DEVICE MANUFACTURING METHOD, ELECTRO-OPTIC DEVICE, AND ELECTRONIC APPLIANCE |
摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable thin-film wiring-pattern. SOLUTION: A film-pattern forming method has a process for forming a barrier plate B on a substrate P, a process for forming a first film-pattern 4a in an opening 2 partitioned by the barrier plate B, a process for removing the portions of the barrier plate B which are opposed respectively to the respective sides of the first film-pattern 4a, and a process for forming a second film-pattern 5 by its plating wherewith the respective sides and the upper portion of the first film-pattern 4a are covered. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2006303275(A) |
申请公布日期 |
2006.11.02 |
申请号 |
JP20050124594 |
申请日期 |
2005.04.22 |
申请人 |
SEIKO EPSON CORP |
发明人 |
DENDA ATSUSHI |
分类号 |
H01L21/288;G02F1/1343;H01L21/3205;H01L21/336;H01L29/786 |
主分类号 |
H01L21/288 |
代理机构 |
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主权项 |
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地址 |
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