发明名称 |
Termoelectric heating and cooling apparatus for semiconductor processing |
摘要 |
A thermoelectric wafer chuck is disclosed. The thermoelectric wafer chuck includes a wafer support surface for supporting a wafer; and a thermoelectric module provided in thermal contact with the wafer support surface for heating and/or cooling the wafer support surface and wafer.
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申请公布号 |
US2006242967(A1) |
申请公布日期 |
2006.11.02 |
申请号 |
US20050119218 |
申请日期 |
2005.04.28 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIN YU-LIANG;LIN CHIN-HSIEN;HWANG JERRY |
分类号 |
F25B21/02 |
主分类号 |
F25B21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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