Substrate replacing and separating device for e.g. wafers, has gripping and transfer mechanism that has gripping components for holding substrates chiseled from substrate block on carrier system, and tilting mechanism for held substrates

摘要

The device (1) includes a gripping and transfer mechanism for gripping and transferring the substrates (2) cut from a substrate block (3) arranged on a carrier system (4). A chisel (7) with a chisel edge (7a) is used to cut the substrates from the substrate block. The gripping and transfer mechanism transfers and hands down the substrate in a direction (10) towards the bottom of the substrate. The gripping and transfer mechanism has gripping components (14,15) between which the cut substrates are received, and a tilting mechanism for tilting the held substrates. The substrates are moved in relative motion with respect to the carrier system with the use of a pulse generator to separate the cut substrates from the substrate block on the carrier system. Nozzles (11) are also provided for injecting fluid into the gap (12) between the substrates.