| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic substrate which is provided with highly reliable three-dimensional wiring conductor without processing to form a through-hole to a ceramic green sheet and to fill the through-hole with a conductive paste. <P>SOLUTION: A constraint layer 19 including inorganic material powder which is not substantially sintered with the sintering temperature of the ceramic green sheet 11 is formed on the same ceramic green sheet 11, an in-surface conductor 13 is formed thereon using a conductive paste, and a projected conductor 14 to become a through-conductor is formed on a part located on the constraint layer 19 of the in-surface conductor 13. Further, the projected conductor 14 is embedded into the ceramic green sheet 11 together with a part of the constraint layer 19 and the in-surface conductor 13 by pressing the whole of the ceramic green sheet 11 together with the projected conductor 14 in the direction of its depth. During the subsequent sintering process, the constraint layer 19 maintains the shape of the through-conductor. <P>COPYRIGHT: (C)2007,JPO&INPIT |
