| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical sensor package and a manufacturing method of a semiconductor device for improving manufacturing characteristics and manufacturing positioning accuracy when glass plate is sealed onto an upper part. <P>SOLUTION: The optical sensor package includes a semiconductor substrate 2 having a conductor 3 for connecting with an external circuit, an optical sensor 1 mounted on the semiconductor substrate 2 and connected with the conductor 3, and a glass plate 5 arrange at an upper face of the semiconductor substrate 2 and sealed with adhesive 6. A through hole 7 is provided for discharging inside air in the semiconductor substrate 2 with its side faces sealed with the glass plate 5. At the same time, an adhesive charging hole 8 is provided as connected to the air discharging through-hole 7 from a position, where the adhesive 6 is applied on the upper face of the semiconductor substrate 2. Then, when the glass plate 5 is sealed onto the upper face of the semiconductor substrate 2, a pressure difference between the inside and the outside of the semiconductor substrate 2 is not generated even after the glass plate 5 is put in contact with the adhesive 6, which was applied onto the upper face of the semiconductor substrate 2, so the manufacturing characteristics and the manufacturing positional accuracy can be improved. <P>COPYRIGHT: (C)2007,JPO&INPIT |
