| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a novel multilayer circuit board with at least one of its surfaces smooth and having a conductive structure between layers formed of a highly reliable columnar conductor. <P>SOLUTION: The multilayer circuit board P has an integral structure with a plurality of circuit boards laminated. At least one of its surfaces is a smooth surface with a land and a conductor circuit leveled with the surface. At least one of conductive structures connecting an upper-layer circuit board 1 with a lower-layer circuit board 2 is made of the columnar conductor 5, including a tip of a bump conductor 5<SB>1</SB>protruding from the lower surface of the upper-layer board 1 and a tip of a bump conductor 5<SB>2</SB>protruding from the upper surface of the lower-layer board 2 coupled directly or via a conductive material. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
