| 摘要 |
PROBLEM TO BE SOLVED: To provide a system on chip for realizing mini antenna matching. SOLUTION: In an emission frequency wave module, each of active elements and each of passive elements are selected. A circuit board 2 is provided with, by using printing technology, a logical circuit and an antenna unit 3 and then there is provided a coupling device of each of the active and passive elements of the emission frequency wave module. In the antenna unit 3, a radiation conductor line of antenna is made up by a single or multiple input terminals and multiple bent lines to constitute a mini-type antenna unit 3. Via the components described above, after an emission frequency wave IC and the active and passive elements have been selected, the antenna unit 3 and a correlative circuit are distributed and arranged in the circuit board 2 together. A sealing outer packaging process is applied to the circuit board 2 by embedding projection, resin injection or the like, so that both upper and lower surfaces of the circuit board are each covered with a sealing outer packaging material 4. Thus, the circuit board involves the emission frequency wave module and the antenna unit 3 by means of sealing and outer packaging. COPYRIGHT: (C)2007,JPO&INPIT
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