| 摘要 |
The present invention discloses a multi-chip semiconductor package for packing a plurality of semiconductor chips of different functions in a signal package while allowing the plural chips to be made by different processes and thus to be assembled in a flexible manner, the multi-chip semiconductor package being characterized in that each chip packed in the package has at least two bonding pads being electrically connected to each other. Hence, the present invention can reduce the overall package size since the layout area required is decrease. Moreover, the design of connecting at least two bonding pads of each chip in the package enables the amount of leads needed in the package to remain the same while the amount of signals to be transmitted is increased, by which the size of the package can remain unchanged.
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