发明名称 |
METHOD OF MANUFACTURING A SOLID IMAGE PICK-UP DEVICE AND A SOLID IMAGE PICK-UP DEVICE |
摘要 |
A method of manufacturing a solid image pick-up device comprising a photoelectronic conversion portion, a charge transfer portion and a peripheral circuit portion, the method comprising: forming a pattern comprising a first layer silicon conductive film to a surface of a semiconductor, the first layer silicon conductive film forming: a first electrode; and a first layer interconnection for the photoconductive conversion portion and the peripheral circuit portion; forming an insulative film at least to a side wall of the first electrode; forming a second silicon conductive film being to form a second electrode to the semiconductor substrate.
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申请公布号 |
KR20060113665(A) |
申请公布日期 |
2006.11.02 |
申请号 |
KR20067007003 |
申请日期 |
2006.04.11 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
AZUMI TEIJI;SATOH TAKANORI |
分类号 |
H01L27/146;H01L27/148;H04N5/335;H04N5/369;H04N5/372 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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