| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a solid-state imaging device for resin-sealing while appropriately protecting the cover glass of a sensor package. <P>SOLUTION: An assembled wiring board 47 to which a number of sensor packages 4 are stuck is set to a cavity 56a in a lower mold die 56 of a transfer mold device 54, and an upper mold die 58 is subjected to die matching to the lower mold die 56. A protective sheet 65 in contact with the upper surface of the cover glass 6 of each sensor package 4 by die matching is mounted into a cavity 58a in the upper mold die 58. The upper surface of the cover glass 6 is covered with the protective sheet 65 so that no gaps are generated. A plunger 62 is operated and a resin 7 for sealing is injected into the cavities 56a, 58a, thus resin-sealing the outer periphery of the sensor package 4 without fouling the upper surface of the cover glass 6. <P>COPYRIGHT: (C)2007,JPO&INPIT |
