| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide die attachment adhesives with improved stress performance capability comprising a resin capable of being cured by free-radical polymerization, a free radical curing agent, and an epoxy compound or resin with a vinyl or allyl unsaturated group. <P>SOLUTION: The die attachment adhesive composition comprises (a) a resin capable of being cured by free-radical polymerization or by hydrosilation, (b) an epoxy compound having a vinyl or allyl functional group, (c) a curing agent for the resin (a), and (d) a filler, in which there is no curing agent for the epoxy compound present. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
