发明名称 |
THIN FILM ELEMENT, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To prevent a thin film element from being broken by a fine crack produced in a cut end face of the thin film element. SOLUTION: A manufacturing method for thin film elements includes the steps of forming multiple thin film elements (15) coupled with one another over a single substrate (20); forming boundary regions (14) between the thin film elements (15) by etching or some other like method to separate the individual thin film elements (15); and cutting the substrate at the boundary regions (14) into the individual thin film elements (15). Thus, a fine crack produced in a cut end face of a thin film element is prevented from developing into it. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2006303166(A) |
申请公布日期 |
2006.11.02 |
申请号 |
JP20050122295 |
申请日期 |
2005.04.20 |
申请人 |
SEIKO EPSON CORP |
发明人 |
KODAIRA YASUAKI |
分类号 |
H01L21/301;H01L21/02;H01L21/336;H01L27/12;H01L29/786 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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