发明名称 THIN FILM ELEMENT, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To prevent a thin film element from being broken by a fine crack produced in a cut end face of the thin film element. SOLUTION: A manufacturing method for thin film elements includes the steps of forming multiple thin film elements (15) coupled with one another over a single substrate (20); forming boundary regions (14) between the thin film elements (15) by etching or some other like method to separate the individual thin film elements (15); and cutting the substrate at the boundary regions (14) into the individual thin film elements (15). Thus, a fine crack produced in a cut end face of a thin film element is prevented from developing into it. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006303166(A) 申请公布日期 2006.11.02
申请号 JP20050122295 申请日期 2005.04.20
申请人 SEIKO EPSON CORP 发明人 KODAIRA YASUAKI
分类号 H01L21/301;H01L21/02;H01L21/336;H01L27/12;H01L29/786 主分类号 H01L21/301
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