发明名称 HEAT DISSIPATION MEMBER, SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipation member which can dissipate heat generated from an electronic component well to the outside or into the atmosphere and can bond the electronic component rigidly. SOLUTION: Carbon fiber sheets formed by braiding first carbon fibers and intersecting second carbon fibers two-dimensionally are laminated in multilayer, the gap between the carbon fiber sheets is impregnated with a metal to constitute a flat plate, and an electronic component mounting portion is provided on the upper surface of the flat plate thus obtaining a heat dissipation member. The first carbon fibers are arranged from the upper surface of the flat plate to reach the lower surface thereof. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006303467(A) 申请公布日期 2006.11.02
申请号 JP20060076662 申请日期 2006.03.20
申请人 KYOCERA CORP 发明人 MIYAUCHI MASAHIKO
分类号 H01L23/373;H01L23/12;H01L23/14;H01L23/15 主分类号 H01L23/373
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