| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board wherein a bump of a conductive material is formed on a wiring substrate, the bump is inserted to a through-hole formed in an insulation sheet for interlayer adhesion, a conductive layer or a composite layer comprising a conductive layer is laminated, heated and fixed by pressure, and a connection defect between the conductive material and the conductive layer after heated and fixed by pressure is not generated, and to provide a highly reliable multilayer printed wiring board. SOLUTION: The manufacturing method of a multilayer printed wiring board has a process for laminating a wiring substrate A which is composed of an insulating layer and a conductive layer and has a bump A of a conductive material, an insulation sheet for interlayer adhesion with a through-hole in a position corresponding to the bump A, and a conductive layer B or a wiring substrate B formed with a bump B formed of a conductive material in a position corresponding to the bump A so that the bump A and the bump B are inserted into the through hole, and they are subjected to lamination press. The multilayer printed wiring board has a conductive part which connects circuits of two layers, and has a large cross section in a contact to the circuit. COPYRIGHT: (C)2007,JPO&INPIT |
