发明名称 METAL FOIL WITH RESIN FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board capable of suppressing resonance between a power source layer and a ground layer and enhanced in the degree of freedom of a design, and a metal foil with a resin for obtaining the printed wiring board. <P>SOLUTION: The metal foil 10 with the resin has a metal foil 11, the resin layer 12 provided on the metal foil 11 and the noise suppressing layer 13, which contains a magnetic metal material, formed on the surface of the resin layer 12. A plurality of the metal foils 10 with the resin are laminated so that each of the noise suppressing layers 3 is positioned between the power source layer and the ground layer on each of the metal foils 11. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006297628(A) 申请公布日期 2006.11.02
申请号 JP20050118845 申请日期 2005.04.15
申请人 SHIN ETSU POLYMER CO LTD 发明人 ODAJIMA SATOSHI;KAWAGUCHI TOSHIYUKI;TAWARA KAZUTOKI;SAGA TSUTOMU
分类号 B32B15/08;H05K1/02;H05K3/46 主分类号 B32B15/08
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