| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which outflow of liquid material can be prevented when a semiconductor element is mounted on a substrate using a liquid ejection method. SOLUTION: The semiconductor device S has an upper surface 12A provided with a connection terminal 3, a first insulating material layer 13 provided on the upper surface 12A, and a second insulating material layer 14 provided on the first insulating material layer 13. The first insulating material layer 13 is provided partially on the periphery of the connection terminal 3, and the second insulating material layer 14 is provided to surround the connection terminal 3. COPYRIGHT: (C)2007,JPO&INPIT |
