| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser improved in the heat dissipating property of a part near the light outgoing end face of a main body in order to prevent the generation of COD (Catastrophic Optical Damage). SOLUTION: A main body 150 having the light outgoing end face 150a for the outgoing of laser light is formed on a semiconductor substrate or an n-type GaAs substrate. The thickness of a fore end 112a of a plated metallic layer 112 formed on the main body 150 near the light outgoing end face 150a is thicker than that of the central part 112b in the direction of a resonator for the plated metallic layer 112. COPYRIGHT: (C)2007,JPO&INPIT
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