| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has good conformity with an LSI process when MEMS devices and CMOS LSIs are mixedly mounted on the same substrate, and which can suppress the effects of moisture, heat, etc. generated from LSI regions on the MEMS devices. SOLUTION: The semiconductor device comprises a semiconductor substrate (500) having a first region and a second region neighboring the first region, an integrated circuit (401) to be formed in the second region, a supporting column structure (414) which is formed on the boundary between the first region and the second region so as to have a wall shape and so as to electrically and spatially separate the first region and the second region, thin film structures (419, 427) which are supported by the supporting column structure and are laminated so as to cover the first region and the second region, and an element (424) which comprises a mechanical movable portion to be arranged in a space to be formed on the lower portion of the thin film structure existing in the first region, and which is electrically connected to the integrated circuit. COPYRIGHT: (C)2007,JPO&INPIT
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