发明名称 Fabric reinforcement using modified cyclic olefin copolymer and resin substrate for printed circuit board
摘要 The present invention is related to a fabric reinforcement using a modified cyclic olefin copolymer and a resin substrate for a printed circuit board. Specifically, the current invention provides a fabric reinforcement using a modified cyclic olefin copolymer, which is prepared from filaments obtained by melting the modified cyclic olefin copolymer including a cyclic olefin copolymer backbone grafted with a monomer having at least one unsaturated carboxylic group, and a resin substrate for a printed circuit board.
申请公布号 US2006246284(A1) 申请公布日期 2006.11.02
申请号 US20060355522 申请日期 2006.02.15
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 OH JUN R.;CHOI CHEOL H.;KIM TAE K.
分类号 D02G3/00;F16J15/20 主分类号 D02G3/00
代理机构 代理人
主权项
地址