HIGH FREQUENCY MODULE

摘要

In a high frequency module, at least a part of a circuit element constituting a first wireless system using a first frequency band and at least a part of a circuit element constituting a second wireless system using a second frequency band are integrally formed. The high frequency module is provided with a multilayer substrate (3) wherein a plurality of dielectric layers are stacked; a first terminal group (31) which is arranged on a first surface of the multilayer substrate (3) and has a plurality of terminals (21, 25a-25d) along a first side (15) among four sides constituting the first surface; and a second terminal group (32) which is arranged on the first surface and has a plurality of terminals (22, 25d, 26a, 26b) along a second side (16) different from the first side (15). The first terminal group (31) includes a first antenna terminal (21) of the first wireless system, and the second terminal group (32) includes a second antenna terminal (22) of the second wireless system.