| 摘要 |
A test pattern on a semiconductor substrate is provided to reduce semiconductor manufacturing costs and to simplify manufacturing processes by using an enhanced unit test pattern structure composed of a main test pattern and a first and a second auxiliary test pattern. A test pattern includes a unit test pattern structure alone. The unit test pattern is composed of a main test pattern, a first auxiliary pattern and a second auxiliary pattern. The main test pattern(11) is formed on a semiconductor substrate in order to evaluate the reliability. The first and second auxiliary test patterns(15,13) are formed on the main test pattern and under the main test pattern, respectively. The first and second auxiliary test patterns are used for monitoring the main test pattern.
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