| 摘要 |
A vacuum solder ball adsorbing apparatus and a method for fixing a solder ball on a substrate using the same are provided to reduce a working time and to simplify a solder ball fixing process by using an improved solder ball fixing mechanism capable of fixing simultaneously a plurality of solder balls to the substrate. A vacuum solder ball adsorbing apparatus includes a housing, a vacuum pump, a gas supply unit, inlet/outlet valves, and a laser beam irradiating unit. The housing(10) includes a gas inlet line(13) for flowing predetermined gas into a chamber(11), a gas outlet line(16) and a plurality of adsorbing holes for adsorbing solder balls(1). The vacuum pump(20) is used for supplying an adsorbing force to the adsorbing holes. The gas supply unit(30) is used for supplying the predetermined gas into the chamber through the gas inlet line. The inlet/outlet valves(14,17) are used for controlling the flow rate of the predetermined gas on the gas inlet/outlet lines, respectively. The laser beam irradiating unit(40) is used for irradiating a laser beam to the solder ball of a substrate(9).
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