METHOD OF FORMING CIRCUIT PATTERN OF PCB

摘要

A method of forming a circuit pattern of a PCB(Printed Circuit Board) is provided to simplify an entire process by reducing the number of a photoresist coating process, an exposure process, and a developing process. An etching solution is applied to a circuit pattern region of an insulating substrate(100). A curing process is performed to cure the etching solution by adjusting curing conditions(110). A coating process is performed to coat metallic ink on an etched circuit pattern(120). A firing process is performed to fire the metallic ink(130). The processes for forming the circuit pattern is performed by using an ink-jet method. The insulating substrate is formed with a polyimide substrate.