| 摘要 |
An organic light emitting device panel is provided to improve heat dissipation performance of an organic light emitting device by promoting a heat transmission operation to the outside thereof. An organic light emitting device(11) is formed on an upper surface of a transparent substrate(10). An encapsulation cap(13) is formed on the upper surface of the transparent substrate in order to cover the organic light emitting device. A heat conductor(16) is formed on an external surface of the encapsulation cap or a rear surface of the transparent substrate of a non-emitting region on which the organic light emitting device is not formed. A plurality of concavo-convex parts are formed on the surface of the encapsulation cap or the transparent substrate on which the heat conductor is formed.
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