发明名称 METHOD FOR PRODUCING CONDUCTIVE WIRING AND CONDUCTIVE BOARD
摘要 A method for producing a conductive wiring and a conductive board are provided to form a fine wiring without including conductive ink by improving a producing method. A carboxyl radical is introduced to a surface of a polyimide based material by applying alkali metal hydration solution onto the surface of the polyimide based material. An adding process is performed to add at least one weak acid solution selected from a group including acetic acid, formic acid, and a mixture of the acetic acid and the formic acid, onto the surface of the polyimide based material. An amine end group is introduced to the surface of the polyimide based material by adding an amine solution to the surface of the polyimide based material. A complex compound is formed by adding a metal compound solution to the surface of the polyimide based material.
申请公布号 KR100643931(B1) 申请公布日期 2006.11.01
申请号 KR20050039083 申请日期 2005.05.11
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KO, YOUNG GUN
分类号 H05K3/00 主分类号 H05K3/00
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