| 摘要 |
<p>A photoresist coating apparatus and a method for removing particles from a wafer using the same are provided to prevent a coating failure of the wafer and to improve particle removing efficiency by using a rinse sprayer and an air supply unit. A photoresist coating apparatus includes a rinse sprayer, an air supply unit, a spin chuck and a dispense nozzle. The rinse sprayer(230) is used for spraying a predetermined rinse solution to a lower surface of a wafer. At this time, the predetermined rinse is sprayed in a fume state. The air supply unit(240) is used for flowing the air from an upper portion of the wafer to a lower portion of the wafer. The spin chuck(225) is used for fixing and rotating the wafer. The dispense nozzle is used for supplying photoresist onto the wafer.</p> |
