发明名称 |
Method of dividing a semiconductor wafer |
摘要 |
A method of dividing a semiconductor wafer comprising: a bonding film adhering step of adhering a bonding film for die bonding to the back surface of the semiconductor wafer; a protective adhesive tape affixing step of affixing an extensible protective adhesive tape to the bonding film side of the semiconductor wafer having the bonding film on the back surface; a dividing step of dividing the semiconductor wafer affixed to the protective adhesive tape into individual semiconductor chips by applying a laser beam along the streets; a bonding film breaking step of breaking the bonding film for every semiconductor chip by extending the protective adhesive tape so as to give tensile force to the bonding film; and a semiconductor chip removing step of removing the semiconductor chips having the broken bonding film from the protective adhesive tape.
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申请公布号 |
US7129150(B2) |
申请公布日期 |
2006.10.31 |
申请号 |
US20040793753 |
申请日期 |
2004.03.08 |
申请人 |
DISCO CORPORATION |
发明人 |
KAWAI AKIHITO |
分类号 |
H01L21/78;B23K26/40;B26D3/00;B28D5/00;H01L21/00;H01L21/301;H01L21/68 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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