发明名称 METHOD OF FILLING DIE WITH SEED MATERIAL
摘要 A method of mold filling with molten material is provided to reduce a time required to recover a temperature after lowering a surface temperature, thereby preventing delay of a manufacturing process. A method of filling a die with a seed material includes the steps of filling a cavity of a mold(20), a temperature of which is increased to a predetermined temperature, with a seed material, disposing the mold on a mold opening position, cooling a surface of the cavity by using fluid, lowering a temperature of the surface of the cavity, filling the seed material into the mold, and disposing the mold on a mold closing position.
申请公布号 KR20060112058(A) 申请公布日期 2006.10.31
申请号 KR20050034444 申请日期 2005.04.26
申请人 JU GANG JI XIE GU FEN 发明人 CHEN FA SHEN
分类号 B29C31/00;B29C45/00 主分类号 B29C31/00
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