| 摘要 |
A printed circuit board is provided to match impedance by compensating the lowering of the impedance in an installing process of a diode for suppressing emission of the static electricity generated from an LVDS(Low Voltage Differential Signaling) transmission line. A printed circuit board includes a plurality of signal layers(101,105,107,111), a plurality of insulating layers(102,104,106,108,110), and a grounding layer(103). A plurality of transmission lines for transmitting predetermined signals and a plurality of anti-electrostatic elements are installed on the signal layers. The grounding layer is formed on a rear surface of the insulating layer. The grounding layer includes a matching layer for exposing a part of the insulating layers. The matching part is formed at a predetermined position corresponding to the anti-electrostatic elements.
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