| 摘要 |
PURPOSE: A packaging method of a semiconductor device is provided to lessen the stress due to the shrinkage and expansion of a package by selectively forming a plurality of through holes in the package. CONSTITUTION: A wafer is divided into a plurality of chips(100) by carrying out die sawing. The chip is attached on a lead frame pad by using Ag epoxy. A wire bonding process is carried out between the chip and a lead frame by using a gold wire, so that the chip is electrically connected with the outside circuit. A hole bar is inserted into a cavity of a mold. An encapsulation part(104) is selectively formed at the resultant structure for completing a package by using the mold. At this time, a through hole(200) is formed in the package. Preferably, a plurality of hole bars are inserted into the cavity of the mold. |
