LEAD FRAME FOR SEMICONDUCTOR PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME

摘要

A leadframe for a semiconductor package is provided to prevent a galvanic potential difference between a Ni plate layer and a layer plated on the Ni plating layer from being increased by forming a Ni-Pd plating layer before a protecting plate layer. A base metal layer(221) of a metal material is plated with a Ni plate layer(222) made of nickel or nickel alloy. The Ni plate layer is plated with a Ni-Pd plate layer(223) made of nickel-palladium based alloy. The Ni-Pd plate layer is plated with a protecting plate layer(224). The atomic concentration of nickel in the Ni-Pd plate layer is 60~95 percent. The protecting plate layer is made of Au or Au-based alloy.