| 摘要 |
A modularized probe head assembly mainly includes a probe head, an interposer and a probe head carrier with guide pins. The probe head has a plurality of first through holes. The interposer has a plurality of second through holes corresponding in location to the first through holes. The probe head carrier is configured to secure the PCB of a probe card and jointing the probe head with the interposer. A via is formed under a pad on the interposer. A plurality of stud bumps are formed on the pad. After assembling of the probe card, the guide pins pass through the first and second through holes and the stud bumps electrically contact the interconnect pad of the probe head.
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