Metal/ceramic circuit board and method for producing same

摘要

A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10 , and a resist 14 having a predetermined shape is formed on the metal layer 12 . Then, an etchant of a mixed solution prepared by mixing ferric chloride with water without adding any acids is used for etching and removing an undesired portion of the metal layer 12 to form a metal circuit 12 on the at least one side of the ceramic substrate 10.