LEADFRAME STRUCTURE FOR SEMICONDUCTOR PACKAGE

摘要

A leadframe structure for a semiconductor package is provided to reduce the region occupied by a conventional silver plating layer by locally forming a silver-plated layer only on a bonding area of the end of an inner lead of a conventional leadframe or by dividing the silver-plated layer. A leadframe structure for fabricating a semiconductor package includes a plurality of inner leads(14). While the end of the inner lead of the leadframe is exposed to an original copper material, a silver-plated layer(10) for wire bonding is formed only in a position that is separated by a predetermined interval and faces the outside.