| 摘要 |
An LED(Light Emitting Diode) package and a manufacturing method thereof are provided to reduce a package size by using an improved light reflective cup made of a plating thin film. A LED package(70) includes a light reflective cup, an insulating layer band, an LED chip, and an adhesive region. The light reflective cup is composed of an anode portion and a cathode portion. The light reflective cup is made of a plating thin film alone. The insulating layer(44) is formed at a portion of the light reflective cup. The LED chip is electrically connected with the plating thin film in the light reflective cup. The adhesive resin is filled in the light reflective cup in order to protect the LED chip. |
