发明名称 |
Suspension board with circuit and producing method thereof |
摘要 |
A suspension board with circuit permits a terminal portion to be formed by electrolysis plating without exposing a conductor layer to outside and a production method thereof. After an insulating base layer is formed on a suspension board in a specific pattern in which a second opening is formed, a thin metal film is formed on the insulating base layer and on the suspension board including the second opening exposed from the insulating base layer. A conductor layer is formed in the form of a wired circuit pattern on the thin metal film. An insulating cover layer is formed with a pad opening therein, and a pad portion formed in the pad opening using the suspension board as a lead portion of the electrolysis plating. A first opening larger than the second opening is formed in the suspension board at a portion thereof corresponding to the second opening.
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申请公布号 |
US7129418(B2) |
申请公布日期 |
2006.10.31 |
申请号 |
US20040944827 |
申请日期 |
2004.09.21 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
AONUMA HIDENORI;OHWAKI YASUHITO |
分类号 |
G11B5/60;H05K1/03;H05K1/05;H05K1/11;H05K3/06;H05K3/10;H05K3/24;H05K3/28;H05K3/38;H05K3/40;H05K3/44 |
主分类号 |
G11B5/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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