发明名称 SIDE VIEW LED PACKAGE HAVING LEAD FRAME STRUCTURE DESIGNED FOR IMPROVING RESIN FLOW
摘要 The invention relates to a side view LED package in use with an LCD backlight unit. The side view LED package comprises: an LED chip; and a strip-shaped lead frame having a toothed structure formed in a lateral edge thereof. The LED chip is mounted on a surface of the lead frame. An integral package body is made of resin, and includes a hollow front half having a cavity for housing the LED chip and a solid rear half divided from the front half by the lead frame. The toothed structure of the lead frame structure can improve resin flow in order to ensure stability even if the LED package is made extremely thin.
申请公布号 KR100638721(B1) 申请公布日期 2006.10.30
申请号 KR20050008218 申请日期 2005.01.28
申请人 发明人
分类号 H01L23/02;H01L33/22;H01L23/495;H01L33/00;H01L33/56;H01L33/62 主分类号 H01L23/02
代理机构 代理人
主权项
地址