发明名称 SEMICONDUCTOR DEVICE DESIGN SUPPORT SYSTEM
摘要 A semiconductor device design support system for supporting wiring design of a bonding wire which connects a semiconductor chip with an interposer. The semiconductor device design support system is provided with a means for generating simulation design data by simulating generation of variance in arranging positions of the semiconductor chips on the interposer and generation of variance in positions of bonding wire connecting terminals of the interposer. The system is also provided with an analyzing means for analyzing troubles in semiconductor device manufacture due to the variance of the arranging positions of the semiconductor chips on the interposer and the variance in positions of the bonding wire connecting terminals of the interposer.
申请公布号 KR20060111681(A) 申请公布日期 2006.10.27
申请号 KR20067014697 申请日期 2006.07.21
申请人 MITSUBISHI ELECTRIC CORPORATION;RENESAS TECHNOLOGY CORP. 发明人 GOTO AKIHIRO;MATSUSHIMA HIRONORI;OGAWA HIROSHIGE;MATSUDA YOSHIO
分类号 H01L21/60;G06F17/50;H01L23/12 主分类号 H01L21/60
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