| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a means in a stacked semiconductor package to simplify the power supply feed path of the semiconductor package of the second layer, to prevent power supply bounce, to prevent the deterioration of signal quality, and to attain the speeding up of signals. <P>SOLUTION: The stacked semiconductor package is provided with a solder ball group 115 joined to a printed circuit board 101 at the rear surface of the semicnductor package 110 of the first layer, a second ball group 125 joined to the semiconductor package of the first layer at the rear surface of the semiconductor package 120 of the second layer, and a solder group 135 for power supply directly joined to the printed circuit board. Consequently, it makes possible to feed power supply directly from the printed circuit board to LSI 122, 123. <P>COPYRIGHT: (C)2007,JPO&INPIT |
