RESIN COMPOSITION AND CURED PRODUCT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which improves the coefficient of thermal expansion in the resin system using both a cyanic acid ester resin and a bismaleimide compound and a cured product using the same. SOLUTION: The resin composition comprises a difunctionality type cyanic acid ester resin (a), a bismaleimide compound (b), and a triphenylmethane type cyanic acid ester (c). COPYRIGHT: (C)2007,JPO&INPIT