| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing device capable of controlling a mold releasing which can control the position between the pattern surface of the mold and the surface to be processed of a workpiece, and the displacement speed changing the position between the pattern surface and the surface to be processed at micrometer level or nanometer level. SOLUTION: The processing device presses the mold 100 having a predetermined pattern and the workpiece 200 to copy the pattern of the mold to the workpiece 200. The processing device is equipped with a displacement means 5 capable of controlling the relative position between the mold 100 and the workpiece 200 and the displacement speed changing the position, an excitation means 6 applying the vibration to at least either the mold 100 or the workpiece 200, a position detection means 7 detecting the relative position between the mold 100 and the workpiece 200, a pressure detection means 8 detecting the pressure between the mold 100 and the workpiece 200, and a control means 300 controlling the operation of the displacement means 5 and the excitation means 6 based on the detection information of the position detection means 7 and the pressure detection means 8. COPYRIGHT: (C)2007,JPO&INPIT
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