发明名称 |
Chemical Mechanical Polishing Apparatus and Methods Using a Polishing Surface with Non-Uniform Rigidity |
摘要 |
A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of the polishing pad that engages the polishing head proximate the edge of the wafer provides less rigidity than a second portion of the polishing pad that engages a portion of the surface of the wafer. For example, the polishing pad and/or the platen may have a recess or other cushioning structure positioned proximate a locus of movement of a portion of the polishing head that supports the edge of the wafer.
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申请公布号 |
US2006240749(A1) |
申请公布日期 |
2006.10.26 |
申请号 |
US20060427360 |
申请日期 |
2006.06.29 |
申请人 |
YUN HYUN J;LIM YOUNG S;BOO JAE P |
发明人 |
YUN HYUN J.;LIM YOUNG S.;BOO JAE P. |
分类号 |
B24B7/30;B24B29/00;B24B37/20;B24B37/24;B24D11/00;B24D13/14;H01L21/304 |
主分类号 |
B24B7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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