| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a display module in which heat dissipation is improved. <P>SOLUTION: The display module includes; a display panel adapted to display an image; a chassis adapted to support the display panel; a driver circuit unit adapted to generate an electrical signal that drives the display panel; an integrated circuit arranged on a signal transmitting unit, the integrated circuit being adapted to control signal transmission between the driver circuit unit and the display panel; and at least one heatpipe arranged on a side of the chassis opposite to the display panel, the heatpipe being adapted to transfer heat generated by the IC chip to the chassis. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
