| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable BGA or CSP-type semiconductor device capable of preventing thermal distortion of a solder bonding portion from concentrating in a local solder bonding portion when the device is mounted on a printed wiring board. <P>SOLUTION: In the semiconductor device 1, a semiconductor element is mounted on one of front and rear surfaces of a substrate 2, a plurality of electrode lands 10a-10c are arranged on the other surface, and each of the electrode lands 10a-10c consists of a substrate side land body formed on the substrate 2 and spherical a solder ball 12 formed on the substrate side land body. In the device 1, the electrode land 10a arranged on the outermost corner A of the substrate 2 is formed so as to have a size larger than the size of the electrode land 10b arranged in an inner region B inner than the outermost corners A, the electrode land 10c in a neighborhood C neighboring to the outermost corner A is formed so as to have a size smaller than the size of the electrode land 10a of the outermost corner A and larger than the size of the electrode land 10b on the inner region B. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
